MicroChemicals GmbH

Photoresists, Ancillaries, Etchants, Solvents, and Technical Support
for all Stages of MicroStructuring and Lithography

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Photoresists
Developers
Remover/Stripper
Thinner/EBR
Adhesion Promotion
Etchants
Etching Mixtures
Solvents

Application Notes

Litho-Trouble-Shooters:

Application Notes (engl.) as PDF

Aluminium Etching

Anti-Reflective Coatings for Photoresists

Baking Steps for Photoresists

Chromium Etching

Development of Photoresist

Dip Coating of Photo Resists

Dry Etching with Photoresist Masks

Electroplating with Photoresist Masks

Etching with Hydrofluoric Acid

Greyscale Lithography

Hardbake of Photoresist Structures

High Resolution Photoresist Processing

Exposure of Photoresists

Laser Exposure of Photoresists

Lift-off Processes with Photoresists

Lithography Trouble-Shooter

Optical Parameters of Photoresists

Photoresist Coating

Photoresist Removal

Process Start-Up & Optimization

Processing image reversal resists

Reflow of Photoresists

Rehydration of Photoresists

Resists, Developers and Removers

(Inferior) Resist Adhesion

Softbake of Photoresist Films

Solvents: Theory and Application

Spin Coating of Photo Resists

Spray Coating of Photo Resists

Storage, Ageing, Refilling, and Dilution of Photoresists

Substrate Cleaning Adhesion Promotion

Thick Resist Processing

Wet Chemical Etching

Wet Chemical Etching of Gold

Wet Chemical Etching of Silicon

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Application Notes (engl.)

Zusätzliche Anwendungshinweise (dt.)

Product Data Sheets
Safety Data Sheets
Brochure 2008/2009
Application Notes

Tech Support Form
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Litho-Forum

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