Image Reversal Photoresists
AZ 5214E
(Datasheet as PDF)
TI 35E (Datasheet as PDF)
TI 35ES
(Datasheet as PDF)
TI Plating
(Datasheet as PDF)
TI xLift
(Datasheet as PDF)
TI Spray
(Datasheet as PDF)
What
image reversal means...
...and
for what it is good for:
AZ
5214E
Film thickness: 1.0 ... 2.0 μm
UV-sensitivity: i-, h-line (310 - 420 nm), NOT g-line sensitive
Sales volumes: 250ml, 500ml, 1000ml, 2.5L, and 5L
General Information
AZ® 5214 E is a very special photoresist which is
capable of image reversal. Exposed areas may be
selectively cross-linked by applying a bake cycle after
exposure. A flood exposure before development converts
unexposed areas soluble, resulting in a negative tone
image. The profile generated by such processing has a
negative shape (wall profile) allowing for use in
lift-off techniques. AZ® 5214 E is the only available
viscosity
AZ 5214 E in small sales units
due to a increasing number of requests we offer now
the AZ® 5214 E beside the 2,5 Liter units also in 250 cc
and 1000 cc bottles.
For further information refer Photoresist
AZ 5214E.pdf
TI 35E
TI 35E is a image reversal photoresist for
wet-etching.
Film thickness: 2.5 .. 4.0 µm
UV-sensitivity: i, h, and g-line (310 - 440 µm),
broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml und 5 Liter
General Information
TI 35E is specially designed for the application in the
so called "image reversal technology" for wet
chemical treatment:
- Etching of Si1-xNx deposited at 400 °C with PECVD
- Etching of stoichiometric SiN in BHF (12.5% HF)
- Etching of thick thermal SiO2 with 20% HF, no
visible degradation of resist after 10 min
- Possible etching in HF conc. (50%) for several
minutes
- Direct mesa grooving without SiO2 masking
For further information Photoresist
TI 35E
TI 35ES
Film thickness: 2.5...5μm
UV-sensitivity:i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes:250ml, 500ml, 1000ml, 2.5L, and 5L
TI 35ES is an image reversal photoresist for
lift-off and dry-etching.
Coating thickness range and exposure
General Information
TI 35ES is specially designed for the application in the
so called "image reversal technology" for:
- subsequent lift-off of deposited layers
- plasma etching with very low resist erosion
For harsh chemical attack, such as direct mesa
grooving in HF-HNO3 containing media or etching in high
HF-concentrations prefer TI 35E. At a resist thickness
of 3.5 µm enables lift-off of evaporated solid films up
to a thickness of 5 µm. The typical aspect ratio of the
structured features achievable is in the range of 1.6 ..
2.0.
Further Information
The following pages give some impressions of the
potential of TI 35ES. The technical data sheets for
detailed processing instructions are available on
request.
TI 35ES for lift-off
TI 35ES for dry-echting
Extraordinary stability of TI 35ES in reversal mode (resist
erosion by a factor of approx. 2 reduced as compared to
most positive resists) allows dry etching of several µm
of SiO2
Both REM picutres:
TI 35ES in reversal mode.
No plasma etching residual remover
Etching of 3.2 µm SiO2 with CHF3 + O
MicroChemicals gratefully acknowledges Mesa+ Research
Institute, University of Twente, Netherlands for
verifying TI 35ES results and providing the pictures
shown in this brochure.
For further information refer Photoresist
TI 35ES
TI Plating
The TI Plating photoresist is optimized for
spray coating of thin (2 µm) to very thick (20 µm)
films. TI Plating can either be processed in positive
mode or negative (image reversal) mode This technical
data sheet intends to give you a guideline for process
parameters for various applications. However, the
optimum values for e.g. dilution, exposure dose, or
development depend on the individual equipment and need
to be adjusted on each individual demand.
For further information refer Photoresist
TI Plating
TI xLift
TI xLift is a image reversal photoresist for
lift-off of thick films.
Film thickness: 4 ... 25 μm sales volumes: from 250 ml
UV-sensitivity: i, h, and g-line (310 - 440 µm),
broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml and 5 Liter
General Information
TI xLift is specially designed for the application in
the so called "image reversal technology" for
subsequent lift-off of thick and very thick deposited
layers. For harsh chemical attack, such as direct mesa
grooving in HF-HNO3 containing media or etching in high
HF-concentrations prefer TI 35E.
What 'adjustable undercut means' - two examples
For further information refer Photoresist
MicroChemicals TI xLift
TI Spray
Film thickness: 0.5 ... 5 µm
UV-sensitivity: i-, h-, g-line (310-440nm)
Sales volumes: 250ml, 500ml, 1L, 2.5L und 5 Liter
General Information
The TI Spray Photoresist is specially designed
for the application in the so called “image reversal
technology” for:
- subsequent lift-off of deposited layers
- wet chemical treatment in HF containing etching
solutions
- direct mesa grooving.
The viscosity enables a direct use in spray coating
equipment for a target thickness of 1 to 10 µm. The
typical aspect ratio of the structured features
achievable is in the range of 1.6 .. 2.0.
This technical data sheet intends to give you a
guide-line for process parameters for various
applications. However, the optimum values for e.g.
exposure dose, or development depend on the individual
equipment and need to be adjusted on each individual
demand.
For further information refer Photoresist
MicroChemicals TI Spray
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Materials.
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