Photoresists, Ancillaries, Etchants, Solvents, and Technical Support
for all Stages of MicroStructuring and Lithography

 

Products       Downloads       Support        News        Company       Contact                   US+Asia contact

deutsch
 

Photoresists
Deep-UV Resist
Developers
Remover/Stripper
Thinner/EBR
Adhesion Promotion
Etchants
Etching Mixtures
Solvents
UV - Filter
Si-Wafer

Deep-UV Photoresist
AZ TX 1311

AZ TX 1311

Film thickness: 2-4 μm
UV-sesitivity: 248 nm
Sales volumes: 250ml, 500 ml, 1000 ml, 3.78 L (gallon)

General Information
The AZ TX 1311 is a deep-UV (DUV) photoresist. This 248 nm photo resist with a thicknes up to 4 μm is designed e.g. for high energy implant applications.

 

Lithography Performance, 0.40 μm spaces at film-thickness of 3.8 μm

Deep-UV Photoresist AZ TX 1311

 

Lithography Performance, 0.40μm lines at film-thickness of 3.8 μm

  
For further information refer Deep-UV Photoresist AZ TX 1311.pdf

  

 

 


®AZ, the AZ logo, BARLi , Aquatar and Kallista are registered trademarks of AZ Electronic Materials.

Overview
Sales volumes

Positive Thin
AZ® 111 XFS 
AZ® 1505 
AZ® 1512HS 
AZ® 1514H 
AZ® 1518 
AZ® 6612 
AZ® 6624 
AZ® 6632
AZ® MiR 701
AZ® ECI 3027

Positive Thick 
AZ® 4533
AZ® 4562 
AZ® 9260 
AZ® 40XT
 

Negative 
AZ®nLof 2070
AZ® 15nXT 
AZ® 125nXT 

Image Reversal/Lift-off
AZ® 5214E 
TI 35E 
TI 35ES 
TI Plating 
TI xLift  
AZ®nLof 2070
 

Deep-UV Photo Resist
AZ® TX 1311
 

Other Resists
AZ® 520D 
AZ®4999 
TI Spray 
PL 177 
AZ®Aquatar
AZ®Barli II

Other Resist Types  
Electroplating Resists
e-Beam Resists
Protective Coating

Spray Coating Resist
P. Circuit Board Resist
Antireflective Coating

Product Data Sheets
Safety Data Sheets
Brochure 2012
Application Notes

Tech Support Form
Interactive Support
Litho-Forum

New Products
New Documents
Exhibitions
Questionnaire

History 
Our Team
Field of Business
Quality Management
What else We Do
Imprint

 

© MicroChemicals 2011 Imprint