AZ 6600 Series Photoresists
AZ 6600 Series
Thermally Stable Positive Resists
Film thickness: 1.0 ... 4.5 μm
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 5 L
General Information
The AZ® 6600 photoresist series yields an improved thermal stability for a better per- formance for dry etching, or – if required – a hardbake. The softening point of approx. 130°C makes the AZ® 6600 resists more stable against rounding during bak- ing steps.
The lateral resolution depends on the resist film thickness and reaches down to sub-μm.
AZ® 6612 and AZ® 6632 standard thin resists cover the thickness range from 1.0 to 4.5 μm. If only one resist is desired for various film thicknesses, this thickness range can be realized by dilution AZ® 6632 (PGMEA = AZ® EBR Solvent):
AZ® 6624 (nominal 2.4 μm at 4000 rpm): 100 g AZ® 6632 + 5.74 g PGMEA
AZ® 6618 (nominal 1.8 μm at 4000 rpm): 100 g AZ® 6632 + 14.7 g PGMEA
AZ® 6615 (nominal 1.5 μm at 4000 rpm): 100 g AZ® 6632 + 20.0 g PGMEA
AZ® 6612 (nominal 1.2 μm at 4000 rpm): 100 g AZ® 6632 + 29.6 g PGMEA
At higher dilution ratios, the AZ® 6600 photoresists are subject to particle formation due to the comparably high PAC concentration.
Development
AZ® 351B 1 : 4 or AZ® 726 MIF recommended; AZ® 400K 1 : 4 or AZ® 326 MIF pos- sible.
For further information refer Photoresist
AZ 6600-series.pdf
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
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